Laser Marking Machine for Screen Disassembly

Laser Marking & Engraving Machine for Smartphone Tablet Screen Replacement

Auto focus UV laser machine refurbishing smartphone screen replacing suitable for cell phone LCD separation and back glass removal and marking metal and jewelry engravings, etc.

Laser Marking Machine for LCD Back Glass Screen Separating Smartphone Tablet

The UV laser engraving machine is to remove the back or front cover of an iPhone and to remove the middle frame of a mobile phone. Additionally, it supports the marking and etching of various materials, such as plastics, stainless steel, leather, wood, and acrylic sheets.

UV Laser Machine for Screen Disassembly:

  • Automatically Focus: Marking positioning is more intuitive, realize precise positioning by projecting graphic trajectory preview
  • Automatically Lifts up and down: Recognize and automatically adjust the height according to the size of the marked item
  • Compact Desktop: Laser marking system with aluminum body material and folding design, compact size, light weight and more portable.
  • Featured high-speed galvanometer
High Precision Laser Galvanometer
High scanning accuracy, sensitive response, accurate focus, good compatibility, more stable and agile marking
High-quality High-definition Field Lens
High resolution, good light perception, uniform illumination, high light transmission
HD Touch Display
Drawing, debugging, high-definition intelligent experience
Free Lift Handle
Convenient positioning, flexible adjustment, more accurate marking
Aluminum Plate Positioning Hole
Standard flexible screw holes, convenient and fast positioning, flexible adjustment
Chiller
Effective temperature control, 24-hour uninterrupted operation

Q & A of the UV Laser Screen Removal Machine
Q: Will you include videos on how to use it?
A: yes, you can check application video at the detail page.

Q: Can i also remove the front glass?
A: Yes. The UV Laser Marking Machine can remove the back front cover of iphone, remove the middle frame of the mobile phone, mark and engrave.

laser marking remove phone screen

Laser-Marking-Machine-for-Screen-Disassembly-Details

Technical Parameters

Model specificationsUV-3-GL-SZUV-3-GL-SZ-WUV-5-GL-SZUV-5-GL-SZ-W
Central wavelength355nm355nm355nm355nm
Laser power>3W>3W>5W>5W
Repeat frequency20-100KHz20-100KHz20-100KHz20-100KHz
Beam qualityM2<1.5M2<1.5M2<1.5M2<1.5
Pulse width<20ns<20ns<20ns<20ns
Spot diameter~0.45mm~0.45mm~0.45mm~0.45mm
Security levelClass IVClass IVClass IVClass IV
Marking speed≤15000mm. The actual marking speed depends on the material.≤15000mm. The actual marking speed depends on the material.≤15000mm. The actual marking speed depends on the material.≤15000mm. The actual marking speed depends on the material.
Repeat accuracy±0.001mm±0.001mm±0.001mm±0.001mm
Minimum characters0.12mm0.12mm0.12mm0.12mm
Minimum mark line width≤0.01mm≤0.01mm≤0.01mm≤0.01mm
Mark range110x110mm(optional 70mm/150mm/180mm)175x175mm(可选100mm/150mm)110x110mm(可选70mm/150mm/180mm)175x175mm(可选100mm/150mm)
Cooling methodAir coolingWater cooling (temperature control accuracy ±0.1℃)Air coolingWater cooling (temperature control accuracy ±0.1℃)
System protection levelIP54IP54IP54IP54
Operating environment requirementsAmbient temperature 15-35℃, relative humidity 30%≤RH≤85%, no oil mist, no condensationAmbient temperature 15-35℃, relative humidity 30%≤RH≤85%, no oil mist, no condensationAmbient temperature 15-35℃, relative humidity 30%≤RH≤85%, no oil mist, no condensationAmbient temperature 15-35℃, relative humidity 30%≤RH≤85%, no oil mist, no condensation
Power requirementsAC220V±5%,50HZ/60HZ,5AmpAC220V±5%,50HZ/60HZ,5AmpAC220V±5%,50HZ/60HZ,5AmpAC220V±5%,50HZ/60HZ,5Amp
Machine power consumption<0.4KW<0.8KW<0.4KW<0.8KW
Total weight33kg (excluding packaging)43kg (laser part 33kg, chiller 10kg, not including packaging)33kg (excluding packaging)43kg (laser part 33kg, chiller 10kg, not including packaging)
Overall dimensions(length*width*height)549x320X668 (size for reference)Laser part 549*320*668 Chiller 345*248*215 (size for reference)549x320X668 (size for reference)Laser part 549*320*668 Chiller 345*248*215 (size for reference)

Configuration

Model specificationsUV-3-GL-SZUV-3-GL-SZ-WUV-5-GL-SZUV-5-GL-SZ-W
LasersGL-3W laserGL-3W laserGL-5W laserGL-5W laser
Scan GalvanometerScanQuickλ=355nm high speed digital galvanometerScanQuickλ=355nm high speed digital galvanometerScanQuickλ=355nm high speed digital galvanometerScanQuickλ=355nm high speed digital galvanometer
Lens150X150mm wavelength focusing lens150X150mm wavelength focusing lens150X150mm wavelength focusing lens150X150mm wavelength focusing lens
Control SoftwareDPEzCADDPEzCADDPEzCADDPEzCAD
ComputerIndustrial touch screen all-in-one computerIndustrial touch screen all-in-one computerIndustrial touch screen all-in-one computerIndustrial touch screen all-in-one computer
Chillers/Desktop DP-Q420 high-precision chiller/Desktop DP-Q420 high-precision chiller
Control CabinetDP-SZ portable cabinet 549*320*150(mm)DP-SZ portable cabinet 549*320*150(mm)DP-SZ portable cabinet 549*320*150(mm)DP-SZ portable cabinet 549*320*150(mm)
Lifting mechanism130 type lift, stroke S=400mm, manual focus130 type lift, stroke S=400mm, manual focus130 type lift, stroke S=400mm, manual focus130 type lift, stroke S=400mm, manual focus

Application Video

 

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