UV Picosecond Laser Marking Machine

UV Picosecond Laser Marking & Engraving Machine
The UV picosecond laser marking machine utilizes ultraviolet lasers with ultrashort pulses to achieve outstanding precision and minimal heat-affected zones. It is widely used in micromachining, medical device manufacturing, semiconductor cutting and engraving, glass processing, as well as cutting and drilling of transparent brittle materials. This technology ensures micron-level accuracy, exceptional edge quality, and efficient processing of delicate or heat-sensitive materials.

UV Picosecond Laser Marking Machine

Ultrafast lasers, such as femtosecond or picosecond lasers, are highly effective in marking, drilling, and engraving due to their exceptional precision and minimal thermal impact. Compared to conventional lasers, they produce cleaner edges, finer details, and negligible heat-affected zones, making them suitable for delicate or high-value materials. They also allow for the processing of a broader range of materials, including brittle and transparent ones, with highest accuracy.

UV picosecond laser marking & engraving machines use laser beams to permanently mark or engrave various types of materials on their surfaces with superior precision and detail.

UV Pico-second Laser Machine for Marking Cutting & Drilling

The ultrafast laser marking machine has been widely used in glass cutting. By using an ultrafast laser with an extremely short pulse width (in the picosecond range), its high power density can focus on the glass surface to form very small light spots, creating stable light filaments within the glass, which makes the material brittle, thus enabling clean cutting.

For multilayer materials (such as glass with polyimide or PET coatings), femtosecond laser cutting machines perform even better. The high precision and short pulse characteristics of femtosecond lasers allow for the simultaneous cutting of different materials in the same process, meeting the market demand for composite material cutting, and improving both efficiency and cutting quality.

Features

  •  AMT UV picosecond lasers feature excellent optical quality, with beam quality (M² < 1.2) and customizable beam roundness exceeding 95%, along with reliable pulse stability (<2%) and power stability (<3%).
  • The lasers offer power options of 5W, 15W, and 30W, with a wide frequency range from 100 kHz to 1600 kHz, customizable up to 10 MHz.
  • At 1 MHz frequency, they can deliver over 30W of power, with single pulse energy exceeding 50 μJ. In burst mode, pulse energy is even higher, and single-pulse adjustments can be made to meet diverse application needs.
  • The lasers support external trigger signal control, offering multiple trigger modes, including high/low level and rising/falling edge triggers, enabling on-demand pulse triggering (POD).
  • AMT UV picosecond lasers are the ideal solution for precision tasks like OLED cutting and drilling, PI/FPC cutting, and mobile phone antenna cutting, thanks to their superior optical quality, exceptional stability, versatile trigger options, and flexible customization features.
laser sourceLaser Source

  • Highly efficient and advanced frequency-doubling technology
  • Edge-trigger and level-trigger control options
  • PWM control and analog power control
  • Excellent beam quality (M² < 1.2)
  • Customizable beam roundness exceeding 95%
  • Stable pulse and power output
  • Fully automated crystal shifting
Scanning Mirror

  • ScanQuick3 λ=1064 nm Digital Scanning Mirror
  • M-series high-speed scanning mirrors can carry a 10mm spot reflection mirror, with a maximum incident spot diameter of 10mm, used in optical scanning, laser marking, drilling, micro-processing, and the medical industrial sector.
  • This optical scanning system features fast speed, low drift, high positional accuracy, and reliable and stable operation. Its overall performance has reached a leading domestic level, mainly suitable for high-speed and online flight marking of fiber, CO2, UV, and other lasers.
  • Supports international XY2-100 standard protocols.
galvanometer scanning
field lensLens λ=1064nm

  • F-theta scanning lens, also known as a field lens, flat field focusing lens, or linear lens. Its image height equals the focal length multiplied by the scanning angle (y=f *θ). Unlike typical focusing lenses that concentrate the beam at a single point, the scanning lens disperses the laser beam into multiple points over the scanning area or workpiece, creating uniformly sized and focused spots of light throughout the entire marking plane.
Control Software

  • Software Kernel: 32-bit or 64-bit.
  • Laser Support: CO2, YAG, fiber, etc. It can adjust laser parameters such as current, pulse frequency, and duty cycle according to different laser specifications.
  • IO Control: Added port control functions to easily achieve automation (one input port, two output ports).
  • Multi-language Support: Built-in Chinese, English, Korean, Japanese, French, and German. You can easily localize it by translating the language pack.
control software
computer monitorComputer Monitors

  • HKC21.5″ V2210
  • 178 Viewing Angle + Non-flicker+16.7 Million Colors + Low Power Consumption≤0.5W
  • Resolution/Refresh
  • Rate:1920*1080/60Hz
  • Dot Pitch:0.248mm
  • Display Color:16.7M
  • Brightness:220cd/m²
  • Contrast Ratio(DCR):20000000:1
Laser Chiller

  • Water-cooled heat dissipation
  • Double digital tube display
  • Full-power cooling and heating control
  • High-precision temperature control, fluctuations can be controlled within 0.5 ℃
  • Sensor failure self-diagnosis function, water flow alarm function
  • The main board adopts high integration chip, strong anti-interference ability.
  • With anti-freezing function, can protect the machine components in low temperature environment.
  • With universal casters, easy to move
  • Compact size, easy to operate, energy efficient, stable performance.

Advantages of UV Picosecond Laser Marking System

Stable Performance

  • Homemade seed source (40000hrs lifespan)
  • Proven solid-state amplifier technology
  • Import of core components

Powerful

  • All-in-one machine design
  • Burst pulse editing function
  • Support PSO function
  • Data monitoring and analysis
  • Power fast switching function

Low Maintenance Cost

  • Modular design, can be maintained separately
  • Quick after-sales response, on-site maintenance, low cost

Features:

  • Superior beam quality (M2<1.2), support PSO, Burst, FFC mode, integrated design, compact structure, high long-term working stability.
  • 24/7 industrial application, AMT-355 Series UV Picosecond Laser.
  • Integrated design, simple structure, reliable performance.
  • Narrow pulse width, high peak power, focus on micro-nano processing field.
  • The operation is simple and user-friendly, and the equipment has good stability; the special control software is compatible with Auto CAD, CorelDRAW, Photoshop and other software output.
  • Can receive various BMP, JPG, DXF, PLT, AI and other format files.
  • Automatically generate various serial numbers, production dates, barcodes, and QR codes.
  • Support flying marking and rotating marking.

Marking Glass – comparison of infrared picosecond and ultraviolet nanosecond

infrared picosecond vs. ultraviolet nanosecond

Picosecond Laser Marking Application:

The picosecond laser can mark a wide range of materials, including metal, plastic, and glass, enabling it to be used for a variety of medical applications.

  • Cutting and drilling of brittle materials, frosted glass surface (glass, sapphire and ceramics)
  • LCD, OLED screen cutting
  • Glassware marked scale – Home Appliance Industry
  • Blackening of battery cell, anti-electrolyte corrosion – New Energy Industry
  • Laser black marking on medical metal – Medical Equipment
  • Acrylic inner carving – Decoration
  • Jade deep carving, 3D relief carving – Crafts
  • Marking of wafers – Semiconductor
  • Aluminum oxide blackening – Metal Processing
  • Ceramic dial scale for smart watch – Smart Wearable
  • Picosecond laser marking for black aluminum oxide – Food Packaging

Widely used in integrated circuit chips, moulds, microelectronics, industrial bearings, clocks, aerospace devices, auto parts, wires and cables, medical equipment, and many other fields of graphics and text marking, mass production line operations.

 

OLED Laser Cutting

Polarizer Laser Cutting

PI Laser Cutting

FPC Laser Cutting

Technical Parameters

ModelZP-30-AOC
Center Wavelength355nm
Laser Power>30W@1000kHz
Repeat Frequency500-1000kHz
Beam QualityM²<1.3
Pulse Width<12ps
Spot Diameter~ 3.5
Marking Speed≤15000mm; The actual marking speed depends on the material
Repeatability±0.001mm
Minimum Character0.15mm
Minimum Marker Line Width32um
Mark Range110x110mm(optional 70mm/150mm/180mm/220mm)
Cooling MethodWater-Cooled
System Protection LevelIP54
Operating Environment RequirementsAmbient temperature 10~35℃ relative humidity 30%≤RH≤85%, no oil mist, no condensation
Power RequirementsAC220V±5%,50HZ/60HZ,5Amp
Overall Power Consumption<1.6KW
Total WeightAbout 140~150kg (excluding packaging)
Dimensions Mm (Length×Width×Height)650×950×1500(dimensions for reference)

Configuration

Optical SystemLaserUV Picosecond DP-AMT-355-30W1
Galvo ScanningScanQuick3              λ=355nm1
Lens110×110mm Wavelength Focusing Quartz Lens1
Control SystemControlling SoftwareEzcad / Dapenglaser1
ComputerIndustrial Control I3/21.5-inch Liquid Display1
ChillerDP-KLD1
Mechanical SystemControl CabinetSheet Metal Cabinet 950*650 mm1
Lifting Mechanism170 Type Lift, Stroke S=550mm, Manual Focus1

Application Video

 

 

 

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