Laser micromachining is widely used for cutting, drilling, texturing, thin-layer removal, marking, or engraving fine details on small or sensitive material surfaces. Femtosecond and picosecond laser marking machines are the most commonly used tools in industrial micromachining, capable of efficiently removing microscopic layers without heating or damaging the components. Femtosecond lasers (10⁻¹⁵ seconds) are significantly faster than picosecond lasers (10⁻¹² seconds), offering superior precision and efficiency for improving the quality and throughput of high-volume production.
- Shorten production cycles
- Achieve high precision during processing
- Enhance product quality
- Minimize post-processing steps (e.g., deburring, polishing, or passivation)
- Reduce thermal impact on surfaces
- Achieve extremely high processing speeds
Ultrashort pulse laser technology enables micron-level marking, engraving, drilling, micromachining, and laser micro-cutting. It is ideal for applications requiring ultra-high precision microstructural processing, such as microelectronics, medical devices, PCBs, semiconductors, and LCD manufacturing.
