Why Use Femtosecond and Picosecond Lasers for Marking & Cutting?
Picosecond(10^-12 seconds) and femtosecond(10^-15 seconds) lasers, with their ultrashort pulse durations, provide excellent precision and minimal thermal impact, making them ideal for high-accuracy marking and cutting across diverse materials such as metals, glass, and delicate substrates. These ultrafast lasers are particularly well-suited for industrial and precision applications, including OLED and LCD manufacturing.
We provide customized femtosecond and picosecond laser marking machines are engineered for 24/7 industrial needs, excelling in marking, drilling, and cutting tasks for materials like sapphire, glass, brittle and transparent substrates, metals, and flexible PCB boards.
LCD & LED Processing
Picosecond lasers enable precise cutting and drilling of LCD and LED components, ensuring smooth edges and micro-scale accuracy. Their ultrafast pulses minimize thermal damage, preserving the integrity of delicate display substrates.
Glass and Brittle Material Processing
Picosecond lasers excel in processing glass and brittle materials by creating clean cuts and microfeatures with minimal chipping or cracking. The short pulse duration generates high power density, allowing for precise structuring and engraving without compromising material strength.
Metal Micromachining
Picosecond lasers deliver unparalleled precision in metal micromachining, enabling intricate designs and burr-free finishes. Their non-thermal processing ensures minimal heat-affected zones, making them ideal for fine applications like stent fabrication, microelectronics, and precision medical devices.
Infrared Picosecond Laser Marking Machine
The Infrared Picosecond Laser Marking Machine excels in high-speed and high-precision marking & engraving, delivering sharp, detailed markings on a variety of materials, including glass and plastics. Its ultrafast pulses minimize thermal effects, ensuring minimal material deformation and achieving flawless surface finishes. It excels in brittle transparent material processing, metal micromachining, and flexible PCB micromachining, making it an ideal solution for industries requiring exceptional precision and durability.
UV Picosecond Laser Marking Engraving & Cutting Machine
The UV Picosecond Laser Marking Machine specializes in ultra-precise, non-thermal processing for semiconductors, PCBs, FCBs, and OLED thin films. Its shorter wavelength enables micro-scale accuracy, making it perfect for delicate, heat-sensitive materials. With near-zero heat-affected zones, it ensures fine detail, high contrast, and reliability, meeting the strict industrial requirements.