UV Precision Laser Cutting Machine

Fully Enclosed UV Precision Laser Cutting Machine

The ultra-precision UV laser cutting machine is a highly advanced and specialized piece of equipment designed for high-precision cutting applications. It utilizes ultraviolet (355nm) laser technology, which provides an extremely focused beam capable of making precise and intricate cuts on a wide variety of materials with minimal thermal impact. UV laser can apply high-contrast markings on sensitive products.

This machine is fully enclosed, ensuring a safe operating environment by containing potentially harmful laser emissions and preventing dust or debris from interfering with the cutting process. The enclosure also helps maintain a stable internal environment that is crucial for maintaining consistent cutting precision.

Equipped with advanced control software and high-accuracy positioning systems, it can handle complex designs with micron-level precision. It is commonly used in industries such as microelectronics, semiconductor manufacturing, medical device production, and other fields where fine detail and clean, accurate cuts are essential.

• This is an industrial UV laser marking machine with patented technology of self-adjusting Z-axis and all-around safety cover. Features include a large, easy-to-open door for comfortable and efficient loading and unloading.
• UV laser markers for highly sensitive materials enable precise marking of extremely fine lines and high contrast without compromising material performance and integrity.
• The workstation is equipped with a fully-enclosed shield to enhance overall safety and an advanced smoke purification system to reduce smoke and dust emissions during laser processing, protecting the environment and operator health.
• The UV laser marking system complies with EU and ISO standard certification and has been certified to maintain stability and reliability even under high-speed operation.

Features:

• The combination of high-precision, low-drift mirrors and servo system platform provides outstanding micrometer-level cutting accuracy, with cutting precision up to ±25um.
• Years of practical experience in process debugging ensure excellent beam quality, with a minimum line width of 25um, minimal heat-affected zone, and low thermal distortion.
• The integrated cabinet with a 60*60mm square steel structure and optical marble platform supports the laser and optical path system, ensuring equipment stability during operation.
• The integration of stress-free cutting mode with fully automatic CCD positioning system delivers perfect cutting results, with smooth edges, no burrs, and no cutting residue.
• Multi-board splicing cutting, automatic positioning, automatic calibration, and automatic expansion/contraction compensation achieve splicing accuracy up to 10um.
• Supports direct import of DXF files for cutting.

Applications:

FPC/PCB, flex-rigid, FR4, cover films, ceramics, silicon, sapphire, silicon wafer micro-holes, blind hole processing, LCD glass QR code marking, drilling on glassware surfaces, coating marking on metal surfaces, plastic buttons, and marking on electronic components etc.