Crystal Glass Wafer Engraving Cutting Green Laser Marking Machine
The green laser marking is designed for micromachining of soft and hard materials, especially marking on glass and crystal engraving. High peak power with excellent beam quality can provide higher power and faster speedmakes this technology indispensable for metallic and non-metallic engraving applications.
The proprietary control software may compatible software output of AutoCAD, CorelDraw, Photoshop, etc. It can realized automatic edition and correction of characters, signs, graphs, images, bar codes, two-dimensional codes, automatically increased serial numbers. It can support various file formats like PLT, PCX, DXP, BMP, JPG, and so on. It may use TIF fonts directly.
- Control software is compatible with AutoCAD, CorelDRAW, Photoshop and other software output.
- Can receive a variety of BMP, JPG, DXF, PLT, AI and other format files.
- Automatically generate various serial numbers, production date, 1D code, 2D code.
- Support fly online marking.
- Support rotary marking.
Features:
- Green laser wavelength is short, focusing spot is smaller, can realize ultra-fine marking.
- Cold processing, heat-affected zone is small, to avoid damage to the processed material, high yield.
- Wide range of applicable materials, to make up for the lack of infrared laser processing capacity.
- The use of high-speed digital galvanometer, marking speed, high efficiency, high precision.
- No need for consumables, low cost of use and maintenance.
- 24-hour non-stop running makes it meet the demand of massive on-line and off-line industrialized production.
| Laser source The green laser used in the green laser marker emits a green light beam at 532nm, with a high photoelectric conversion rate. Due to its higher power compared to ultraviolet lasers, it is more suitable for marking and cutting materials such as stainless steel, copper alloys, glass, gemstones, ceramics, electroplated buttons, gold-plated objects, optical lenses, ceramics, and high-temperature PCB boards. The precision of the green laser marker can also reach 0.2mm, and the overall power consumption is relatively low. Green lasers are commonly employed for internal engraving and cutting on materials like glass and crystal. |  |
 | ScanQuick3 λ=532nm digital galvanometer The M series high-speed scanning mirrors can carry a 10mm light spot reflecting mirror, with a maximum incident light spot diameter of 10mm. They are applied in optical scanning, laser marking, drilling, micro-processing, and the medical industry. This optical scanning system features high speed, low drift, high positional accuracy, and reliable and stable operation. Its overall performance has reached a leading level domestically, and it is mainly suitable for high-speed and online flying marking of lasers such as fiber and YAG. It supports the international standard protocol XY2-100. |
| Lens λ=532nm The F-theta scanning lens, also known as a field lens, flat field focusing lens, or linear lens, has an image height equal to the focal length multiplied by the scanning angle (y = f * θ). In contrast to typical focusing lenses that concentrate the laser beam to a single point, the scanning lens disperses the laser beam to multiple points on the scanning area or workpiece. This results in a uniformly focused spot of light across the entire marking plane. |  |
 | Control System EzCad Software Core: 32-bit or 64-bit. Laser Support: CO2, YAG, FIBER, etc. The software enables adjustment of laser parameters such as current, pulse frequency, and duty cycle based on different laser specifications. IO Control: Added port control functionality for easy automation (one input port and two output ports). Multilingual Support: Built-in Chinese, English, Korean, Japanese, French, and German. Translation can be customized using language packs.
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Applications:
Green laser marking machine is applicable to marking and surface treatment of various glass, liquid crystal screens, textiles, thin ceramics, semiconductor silicon wafers, IC grains, sapphire, polymer films and other materials, such as mobile screen, LCD screen, optical devices, automotive glass, hardware, ceramics, glasses, clocks, electronic devices, instruments, PCB boards and control panels, display boards, plastics.
- Suitable for marking the surface of glass, polymer materials and other objects, microporous processing.
- Widely used for marking the surface of packaging bottles (boxes) of polymer materials such as food, drugs, cosmetics, wires, etc., and micro-hole punching (aperture d≤10μm).
- Flexible PCB board, LCD, TFT marking, scribing and cutting.
- Metal or non-metal plating removal.
- Silicon wafer micro-hole scribing, blind hole processing.
- Widely used in semiconductor and photovoltaic industry processing.
